Plastic package.

Glass passivated chip junction in SMC Package

Excellent clamping capability.

Low zener impedance.

1500W peak pulse power capability on 10/1000μs waveform.

Typical IR less than 1μA above 13V.

Fast response time: typically less than 1.0ps from 0 Volts to BV min.

High temperature soldering guaranteed: 265℃/10 seconds