Plastic package.

Glass passivated chip junction in SMA Package

Excellent clamping capability.　

Low zener impedance.　

400W peak pulse power capability on 10/1000μs waveform.

Typical IR less than 1μA above 13V.

Fast response time: typically less than 1.0ps from 0 Volts to BV min.

High temperature soldering .guaranteed: 265℃/10 seconds